Typical ESD Flex Applications Include:

• Semi-con: HDD Components, Wafer Handling, Jigs, Casings, & Connectors
• Industrial: Conveying, Metering, and Sensing Applications

Target Conductivity for 3DXSTAT ESD Flex:

• 10^7 to 10^9 ohm surface resistivity on 3DP sample using concentric ring test method.
• Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently, not to mention varied part geometry. Therefore, expect some trial time to understand how ESD Flex filament works in your specific printer and application.

Surface Conductivity as a Function of Extruder Temperature:

The surface resistance of the printed ESD Flex part will vary depending on the printer’s extruder temperature. For example, if your testing indicates the part is too insulative, then increasing the extruder temperature will result in improved conductivity. Therefore, the surface resistance can be ‘dialed-in’ by adjusting the extruder temperature up or down depending on the reading you receive on your part.

Filament Specifications:

1.75mm and 2.85mm +/- 0.05mm in diameter

Recommended ESD Flex Print Settings:

• Extruder: 220-240°C
• Bed Temp: 40-60°C
• Bed Prep: 3Dlac, Printafix or Dimafix gives us the best results.
• Heated Chamber: Not required
• Supports: PVA Supports works with this filament.
• Drying Instructions: 65°C for 4 hours.